CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES

نویسندگان

چکیده

A simulation of the cooling electronic devices was carried out by means microchannels, using water as a coolant to dissipate heat generated from computer processor, and thus stabilize its optimum operating temperature. For development this study, computational fluid mechanics modeling established in order determine temperature profiles, pressure velocity behavior working microchannel. In results temperatures processor were obtained, ranges 303 K 307 K, with velocities microchannels 5 m/s, drop 633.7 kPa, factor safety design microchannel 15. From results, improvement transfer system evidenced when compared forced air flow traditional. ABSTRAK: Simulasi penyejukan alatan elektronik telah dibina menggunakan saluran mikro, di samping sebagai agen penyejuk bagi menghilangkan haba yang terhasil dari pemproses komputer, dan penstabil pada suhu operasi optimum. Kajian ini mengenai model komputasi mekanik bendalir menentukan profil suhu, tekanan, halaju perubahan dalam mikro. Dapatan kajian menunjukkan komputer adalah julat sehingga dengan mikro kelajuan penurunan tekanan sebanyak faktor keselamatan 15 reka bentuk Ini terdapat kenaikan pemindahan sistem ini, terutama apabila cecair digunakan berbanding kaedah tradisi iaitu mengguna pakai aliran udara penyejuk.

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ژورنال

عنوان ژورنال: IIUM Engineering Journal

سال: 2022

ISSN: ['2289-7860', '1511-788X']

DOI: https://doi.org/10.31436/iiumej.v23i1.2113